Analytical thermal modelling of multilayered active embedded chips into high density electronic board

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TitreAnalytical thermal modelling of multilayered active embedded chips into high density electronic board
Publication TypeJournal Article
Year of Publication2013
AuthorsMonier-Vinard E, Laraqi N, Dia C, Nguyen M, Bissuel V
JournalThermal Science
Volume17
Pagination695–706
ISSN0354-9836
URLhttp://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361300072M
DOI10.2298/TSCI120826072M