Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

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TitreAnalytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader
Publication TypeJournal Article
Year of Publication2014
AuthorsMonier-Vinard E, Laraqi N, Dia C, Nguyen M-N, Bissuel V
JournalThermal Science
Pagination143–143
ISSN0354-9836
URLhttp://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361400143M
DOI10.2298/TSCI140403143M