Thermal design of tilted electronic assembly with active {QFN}16 package subjected to natural convection

Soumis par admin le jeu, 01/12/2017 - 19:34

TitreThermal design of tilted electronic assembly with active {QFN}16 package subjected to natural convection
Publication TypeJournal Article
Year of Publication2015
AuthorsBaïri A
JournalInternational Communications in Heat and Mass Transfer
Volume66
Pagination240–245
ISSN07351933
URLhttp://linkinghub.elsevier.com/retrieve/pii/S0735193315001220
DOI10.1016/j.icheatmasstransfer.2015.06.008