Analytical modeling of multi-layered {Printed} {Circuit} {Board} dedicated to electronic component thermal characterization

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TitreAnalytical modeling of multi-layered {Printed} {Circuit} {Board} dedicated to electronic component thermal characterization
Publication TypeJournal Article
Year of Publication2015
AuthorsMonier-Vinard E, Laraqi N, Dia C-T, Nguyen M-N, Bissuel V
JournalSolid-State Electronics
Volume103
Pagination30–39
Date Publishedjan
ISSN00381101
URLhttp://linkinghub.elsevier.com/retrieve/pii/S0038110114002342
DOI10.1016/j.sse.2014.09.004