Correlations highlighting effects of the {PCB}’s {Copper} ratio on the free convective heat transfer for a tilted {QFN}32 electronic package

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TitreCorrelations highlighting effects of the {PCB}’s {Copper} ratio on the free convective heat transfer for a tilted {QFN}32 electronic package
Publication TypeJournal Article
Year of Publication2016
AuthorsBaïri A
JournalInternational Journal of Heat and Mass Transfer
Volume92
Pagination110–119
Date Publishedjan
ISSN00179310
URLhttp://linkinghub.elsevier.com/retrieve/pii/S0017931015009114
DOI10.1016/j.ijheatmasstransfer.2015.08.064