Temperature determination of tilted electronic assemblies equipped with basic and wire-bonded {QFN}16 and 32 devices subjected to free convection

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TitreTemperature determination of tilted electronic assemblies equipped with basic and wire-bonded {QFN}16 and 32 devices subjected to free convection
Publication TypeJournal Article
Year of Publication2016
AuthorsBaïri A
JournalApplied Thermal Engineering
Volume102
Pagination565–569
Date Publishedjun
ISSN13594311
URLhttp://linkinghub.elsevier.com/retrieve/pii/S1359431116303362
DOI10.1016/j.applthermaleng.2016.03.044