Free convective overall heat transfer coefficient on inclined electronic assembly with active {QFN}16 package

Soumis par admin le jeu, 01/12/2017 - 19:34

TitreFree convective overall heat transfer coefficient on inclined electronic assembly with active {QFN}16 package
Publication TypeJournal Article
Year of Publication2016
AuthorsBaïri A
JournalInternational Journal of Numerical Methods for Heat & Fluid Flow
Volume26
Pagination1446–1459
ISSN0961-5539
URLhttp://www.emeraldinsight.com/doi/full/10.1108/HFF-04-2015-0142
DOI10.1108/HFF-04-2015-0142